DOB封装 DOB封装 Ø29 Ø33 Ø33-DTW Ø34 Ø38-III Ø47-III Ø57-III Ø60-III Ø90-III 艾笛森DOB基于镜面铝基板进行设计开发(反射率大于98%，导热率200w/mK)，搭配顶尖恒流IC，内置过温保护功能，简化电路设计，提供客户一个高效率、高PF、低THD和低频闪的产品 DOB II 系列 D29 D33 D33-DTW DOB III 系列 D34-III D38-III D47-III D57-III D60-III D90-III Ø29 DOB LC C290723 DOB LC C291023 DOB C291223 DOB C291423 DOB LC C290712 DOB LC C291012 DOB C291212 DOB C291412 Ø33 DOB C330723 DOB C331023 DOB C331223 DOB C331423 DOB C330712 DOB C331012 DOB C331212 DOB C331412 Ø33-DTW DOB PHI33 Dim to Warm 230V D34-III DOB III Ø34 4W DOB III Ø34 5W Ø38-III DOB III Ø38 6W DOB III Ø38 8W DOB III Ø38 10W Ø47-III DOB III Ø47 6W DOB III Ø47 8W DOB III Ø47 10W DOB III Ø47 6W (COB) DOB III Ø47 8W (COB) DOB III Ø47 10W (COB) Ø57-III DOB III Ø57 12W DOB III Ø57 15W DOB III Ø57 15W (COB) DOB III Ø57 18W (COB) DOB III Ø57 20W (COB) Ø60-III DOB III PHI60 12W Ø90-III DOB III PHI90 30W
